Technology of laser beam machining makes the efficiency of the solar battery rises 22%

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Technology of laser beam machining is the most crucial technology in RISE machine program. The technology of blame contact laser beam machining that uses as a result of them applies already in most other industry, because craft of this RISE treatment is comfortable,accumulate industry of crystal silicon small chip to produce RISE solar battery at using bedding face, this will make its produce cost to send little can compare with the manufacturing cost photograph of nowadays standard solar battery. Current, the solar battery that makes by crystal silicon already was in solar energy is photo-generated regnant position is held on voltaic product market. Efficiency of one report changeover is the light of solar battery of silicon of general industry crystal 14%~16% , and one report changes the light that uses technology of new laser beam machining to be able to raise a solar battery efficiency. The researcher of institute of German Institut Fur Solarenergieforschung Hameln (ISFH) has developed the treatment technology that gives a kind of production solar battery, carry alternate sheet on the back namely second evaporate (RISE) craft. Complementary with technology of laser beam machining, the carries contact silicon solar battery on the back photoelectricity changeover efficiency that manufactures with this craft is achieved 22% . Current, a lot of manufacturer use technology of laser beam machining to produce silicon solar battery. BP Solar company (Frederick, MD) uses laser to engrave groove to bury grid technology, use laser technology to be in that is to say silicon apparently quarter chamfer, fill person metal next, arrive in order to rise before the action of grid of exterior report contact. Compare with photograph of layer of metal of apply of plating of the surface before the standard, the advantage of this kind of technology is to be able to reduce screen loss. Advent Solar company uses additionally one kind to be weighed connect to launch an area to surround a wall to guide (Emitter Wrapthrough) technology. Via is gotten on silicon chip with laser, the electric current of the surface before tall impure wall will launch a division conducts the metal that carries the surface on the back to contact a layer, can reduce screen loss further consequently, raise light one report changes efficiency. Blame contact treatment is using R1SE craft to produce solar battery course in, use method of laser beam machining to make alternate graph blast off in solar battery the reverse side area and base area, reliable ground is detached after laser ablation still can make contact a layer to evaporate in the metal from alignment (refer to graph 1) . Blame contact is machined (very important to reducing chip to injure) use buccal switch above all 355 NmNd:Y of 3 times frequencyVO4 laser changes silicon to perhaps oxidize in the nitrogen of the reverse side of crystal silicon chip the ablation in silicon layer gives those who show across pointing to shape to blast off area and base area graph. Any injury of chip can shorten carry stream child life, also can reduce light likewise one report changes efficiency. Use oxyhydrogen to change potassium next (the scathing share that KOH) corrodes treatment to be brought about with place of purify laser beam machining. After the course is corroded, glow material diffuses form emissive division, remain raised nitrogen to change silicon and oxidation to regard as base area. Be in wet and chemical before corroding, next treatment working procedure are to use a metal to evaporate to contact a separate treatment to depart from alignment emissive area and base area. To make the changeover efficiency of the solar battery achieves maximize, ISFH institute and German Laser Zentrum Hannove: ? Beard of Qi of  of Zheng of ⑾ of Bei of cough of  lens hard core embraces す of ぜ of ǔ of  of brilliant of argon of neon Ti  to hold sb in respectful awe Xiang Cong Fei is foolish Hu of wooden   rips Ting OH to corrode deepness to concern. And, nd:Y of 3 times frequencyThe deepness that ablation of laser of AG 355 Nm brings about chip to injure is Nd:Y of duple frequency of 3 μ M;The deepness that ablation of laser of AG 532 Nm brings about chip to injure is 4 μ M; and Nd:YThe scathing deepness that laser of AG 1 064 Nm brings about can exceed M of 20 μ . The scathing layer that wants purify only achieves such deepness, won't affect a solar battery so the changeover efficiency of 20% above, but closely related the ply of deepness and laser cost cost and silicon chip, the need in producing a course is mature. The solar battery studies the researcher of the group thinks, technology of laser beam machining is the most crucial technology in RISE machine program. The technology of blame contact laser beam machining that uses as a result of them applies already in most other industry, because craft of this RISE treatment is comfortable,accumulate industry of crystal silicon small chip to produce RISE solar battery at using bedding face, this will make its produce cost to send little can compare with the manufacturing cost photograph of nowadays standard solar battery. CNC Milling